Intel Foundry Advanced System Assembly & Test Solutions Support Every Product Stage

By Mark Gardner, Vice President and General Manager of the Packaging and Test Business Group at Intel Foundry

Intel Foundry is expanding its role in the semiconductor industry by opening its doors to external customers and positioning itself as a full-service foundry for the AI era. Beyond wafer fabrication, one of our strengths is acting as an Outsourced Semiconductor Assembly and Test (OSAT) provider through our Intel Foundry Advanced System Assembly & Test (Intel Foundry ASAT) services. These capabilities support products designed on any foundry’s process node architecture, allowing collaboration at every stage of development — from initial concepts to converting fully designed products. Intel Foundry’s advanced packaging solutions and expertise help our customers enhance existing designs or launch new ones without significant redesign costs.

With Intel Foundry ASAT, you can incorporate our industry-leading packaging and test technologies — including 2D, 2.5D, 3D, and 3.5D integration — into your product lifecycle. These services enable the creation of complex, multi-die and chiplet-based systems ideal for high-performance computing (HPC) and AI workloads. The flexibility of the Intel Foundry ASAT model allows our customers to merge cutting-edge packaging innovations, such as Embedded Multi-die Interconnect Bridge (EMIB) and Foveros technologies, into both new and existing designs. This approach provides a path to integrating advanced technologies with minimal disruption, helping bring powerful, efficient solutions to market faster.

Intel Foundry ASAT Delivers More than a Traditional OSAT

Many chip designers and manufacturers outsource complex backend processes to OSATs. Like an OSAT, Intel Foundry ASAT provides specialized services for packaging and testing integrated circuits (ICs) after their initial fabrication on silicon wafers, transforming raw wafers into functional and reliable semiconductor products. This includes die preparation to process completed wafers into individual ready-to-assemble dies, assembly and packaging, and final testing. Intel Foundry's involvement in developing and implementing industry standards like the Universal Chiplet Interconnect Express (UCIe) allows for open and flexible chiplet-based designs.

What makes Intel Foundry ASAT unique is our broader systems foundry approach, providing a complete full-stack solution for chip manufacturing, including system design, process technology, advanced packaging and assembly, and testing.

Intel Foundry ASAT brings technology to optimize solutions at the system level or work with your existing ecosystem partners. By combining different front-end and back-end technologies for improved performance and efficiency, we can engage at any stage of development or conversion.

Designed for Competitive Advantage

Changing suppliers is a significant decision — converting chiplets can involve considerable cost, risk, and time. For customers to make such a transition, it must deliver a clear benefit in at least one of three areas: cost efficiency, product optimization, or supply chain resilience. The Intel Foundry ASAT portfolio helps customers meet these objectives with a proven range of advanced packaging solutions. In a rapidly evolving industry moving from monolithic system-on-chip architectures toward heterogeneous systems-of-chips, we offer proven high-volume manufacturing (HVM) technologies that enable optimized designs and the flexibility to mix and match process node architecture — from any foundry — within a single package.

Cost efficiency: EMIB offers one of the most effective solutions for connecting chiplets. EMIB delivers high-bandwidth, horizontal integration for multiple chiplets built with different nodes and functions, such as logic and memory, in a single package. It extends performance beyond the size limits of silicon interposers while reducing silicon usage and eliminating an entire wafer-level assembly step — providing a more cost-efficient alternative.

Additionally, Intel Foundry’s singulated die sort is a best-in-class yield differentiator, providing the ability to test at the die versus wafer level to deliver more known good die and die stacks to assembly. For testing, we offer services across all phases of the manufacturing process, using commercially available automated test equipment (ATE) or our High Density Modular Testers (HDMT), depending on your needs. We offer HDMT solutions for all stages of the test process, from wafer and die sort to burn-in to final and system-level testing, reducing costs and accelerating time to market.

Product optimization: For even denser integration and product optimization, our Foveros 2.5D wafer-level stacking technology enables vertical stacking of chiplets on a base die, creating compact, power-sensitive designs for mobile processors, AI accelerators, and CPU/GPU stacks. Offered in silicon interposer, redistribution layer (RDL), or RDL-with-bridges configurations, Foveros allows customers to deploy advanced nodes only where needed while placing less critical functions on mature nodes — reducing design costs without compromising performance.

Supply chain resilience: Beyond technology, supply chain resilience is bolstered by Intel Foundry’s global assembly and test network, including the largest 2.5D advanced packaging capacity in the U.S. and a robust ecosystem of suppliers and partners to ensure on-time, uninterrupted product delivery.

Intel Foundry ASAT Can Meet Your OSAT Needs

Intel Foundry ASAT delivers advanced packaging solutions designed to optimize performance, reduce costs, and strengthen your supply chain. Our robust technology portfolio, backed by world-class design expertise, offers flexible options to seamlessly convert or enhance existing designs. Intel Foundry ASAT offers end-to-end support — from design through assembly to test — to bring your vision to market faster and more effectively.

If you are interested in learning more about Intel Foundry ASAT services, please reach out to us at foundry.contact@intel.com.