Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace

By Chek-San Leong, Senior Director, Head of IP and Chiplet Ecosystem Alliance at Intel Foundry

As the semiconductor industry continues to push the boundaries of performance, scalability, and innovation, chiplet-based designs have emerged as a critical enabler of the next wave of computing architectures. Intel Foundry is uniquely positioned to support the creation of an open chiplet marketplace, bringing together world-class technology, manufacturing, and ecosystem solutions.

An Open Vision: Intel Foundry’s Strategic Advantages

While the industry is still in the early stages of establishing a seamless market where chiplet offerings from multiple vendors can easily be integrated into a system, Intel Foundry is committed to supporting the definition of the necessary infrastructure and standards to make this vision a reality. This year, we established the Intel Foundry Chiplet Alliance with the goal of helping customers access a comprehensive portfolio of validated electronic design automation (EDA) tools, intellectual property (IP), and design services from trusted ecosystem partners.

These programs are designed with the vision of creating an open ecosystem for heterogeneous integration of chiplets, enabling our partners to drive innovation and offer world-class solutions to the market. Now, we are driving proof-of-concept (POC) programs with ecosystem partners, including recent programs with QuickLogic and Trusted Semiconductor Solutions Inc., underscoring how our approach sets us apart from other foundries.

Today, Intel Foundry stands apart as the only US-based fabrication network offering leading-edge, Angstrom-era, RibbonFET gate-all-around (GAA) technology available on the Intel 18A and Intel 14A node families. This innovative technology provides customers with unmatched geopolitical assurance and supply chain resilience. Beyond silicon process leadership, we also provide technologies enabling cutting-edge system integration. Customers can optimize individual chiplets for specific functions, such as high-performance computing (HPC) or power efficiency, and then integrate them using Intel Foundry’s advanced packaging technologies, including Foveros and Embedded Multi-die Interconnect Bridge (EMIB).

Our commitment to innovation extends to industry-standard interface IPs optimized for the latest process node, including Universal Chiplet Interconnect Express (UCIe), High Bandwidth Memory (HBM), and Peripheral Component Interconnect Express (PCIe). This allows customers to seamlessly integrate heterogeneous chiplets from multiple vendors while ensuring high performance, power efficiency, and scalability.

A Vibrant and Secure Chiplet Ecosystem

Intel Foundry is cultivating a vibrant chiplet ecosystem that supports early customer engagement across diverse markets ranging from commercial to mission-assured government applications. Hardware-based security, a secure supply chain, and protection against tampering are crucial to ensure the integrity, confidentiality, and reliability of microelectronics used in military, aerospace, and government applications. Intel Foundry addresses these security needs through the USMAG Alliance, which combines a trusted design ecosystem with US-based, advanced manufacturing to meet stringent design and production requirements.

We are taking steps to shape the open chiplet marketplace as secure, flexible, and customizable — enabling customers to accelerate design cycles while maintaining the highest levels of IP protection and design integrity.

Through close collaboration with ecosystem partners, we’re enabling innovators to explore chiplet architectures that meet both commercial scalability and defense-grade reliability, bridging performance and trust in one platform.

Proof-of-Concept Collaborations

To further demonstrate the power of open collaboration, Intel Foundry is driving two POC programs with key ecosystem partners:

• QuickLogic: Exploring AI-enabled field-programmable gate array (FPGA) chiplets and open-source design flows to enhance flexibility and time-to-market for adaptive compute applications.
• Trusted Semiconductor Solutions Inc.: Developing custom system-in-package (SiP) solutions utilizing the best-in-class domestic assembly technologies and packaging technology. These solutions demonstrate the use of Intel Foundry’s EMIB-T for 2.5D assemblies with a roadmap to 3D using Intel Foveros technology.

These collaborations represent a tangible step toward realizing the open chiplet marketplace vision, showcasing how industry partnerships can unlock new performance frontiers while accelerating innovation.

Building the Future Together

As we move forward, Intel Foundry remains committed to leading the industry toward an open, interoperable, and trusted chiplet ecosystem. By combining our manufacturing excellence, advanced packaging, and deep ecosystem partnerships, we’re enabling a new era of modular design by driving innovation.

Learn more about how Intel Foundry can help accelerate your products to market. Reach out to us at foundry.contact@intel.com