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Recognizing Amazing Technologists: Intel’s Newest IEEE Fellows

ScottBair
Employee
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Scott Bair is a key voice at Intel Labssharing insights into innovative research for inventing tomorrow’s technology.

 

Highlights: 

  • Institute of Electrical and Electronics Engineers (IEEE) Fellows for 2023 are elevated in recognition of their extraordinary accomplishments and vital contributions to the advancement or application of engineering, science, and technology. 
  • Intel’s newest IEEE Fellows include Harald Gossner, and Muhammad M. Khellah and Sriram Vangal from Intel Labs.  

 

Congratulations to Intel’s IEEE Fellow Class of 2023! 

This year three Intel technologists were named Institute of Electrical and Electronics Engineers (IEEE) Fellows for their extraordinary accomplishments and vital contributions to the advancement or application of engineering, science, and technology. IEEE is the world’s largest technical professional organization dedicated to advancing technology innovation and excellence for the benefit of humanity. 

The IEEE Fellow grade recognizes exceptional distinction in engineering and significant value to society with candidates from government, academia, and industry sectors.  Conferred by the IEEE Board of Directors, nominees are evaluated on individual technical or educational contributions to the engineering field, the impact of these contributions, and the verifiable evidence supporting the case. This may include significant industry publications, patents, presentations, or standards committee work.  

Industry recognition of the outstanding contributions of Intel technologists enhances Intel’s leadership within the engineering ecosystem. Just one-tenth of one percent of the total voting membership can be elevated to IEEE Fellow each year.  For 2023, only 16% of the total nominees came from the industry. Of these industry nominees, one-third were elevated to IEEE Fellow. Technical insights and solutions gained from industry impact have a direct benefit to Intel. 

 

image002.JPGHarald Gossner was elevated to IEEE Fellow for contributions to Electrostatic Discharge (ESD) design of advanced Integrated Circuit (IC) devices and high-speed systems. 

Harald Gossner is Senior Principal Engineer at Intel. He received his degree in physics (Dipl. Phys.) from the Ludwig-Maximilians-University, Munich, in 1990 and his Ph.D. in electrical engineering from the Universität der Bundeswehr, Munich, in 1995. After 15 years of working on the development of ESD protection concepts, he joined Intel, where he is leading the system ESD activities for Intel products. 

Harald has authored and co-authored over 150 technical papers and two books on ESD and device physics. He also holds 110 patents in the field. He is the four-time recipient of the best paper awards of the EOS/ESD Symposium. In 2015 he received the Outstanding Achievement Award from the ESD Association. He served as Technical Program Chair and General Chair of the EOS/ESD Symposium and the International ESD Workshop. In 2006 he became co-founder and co-chair of the Industry Council on ESD Target Levels. As of 2022, he is the President of the ESD Association. Beyond this, he is editor of IEEE Electron Device Letters. As a member of the European Ecosystem Steering group at Intel Germany, Harald helps to establish an RnD and design ecosystem for leading-edge Complementary Metal–Oxide–Semiconductor (CMOS) technologies in Europe.  

 

image003.GIFMuhammad M. Khellah was elevated to IEEE Fellow for contributions to design technology co-optimization of on-die dense memory and fine-grain power-management circuits. 

Muhammad M. Khellah is a Research Scientist at Intel Labs, where he currently leads research on power management, design-technology co-optimization, and application-driven HW acceleration. After receiving his Ph.D. from the University of Waterloo, Canada, in 1999, Muhammad first joined TD and led the design of on-die SRAM caches for the Pentium microprocessor product line. Muhammad received an IAA in 2012 as part of Intel Labs and TD's joint effort to enable continued SRAM scaling at Intel and the Industry.  

Muhammad serves now on the EC of ISLPED and previously served as associate editor for TCAS-I, special-issue editor for JSSC, Technical Program Chair & General Co-Chair of ISLPED, special-sessions chair of CICC, and a TPC member of ISSCC.  He has published 107 technical papers and has 126 patents granted, with a few more pending. Muhammad is an active mentor of Intel-sponsored university research and was presented with the 2018 Mahboob Khan’s outstanding SRC industry liaison award for his efforts. 

 

image004.JPGSriram Vangal was elevated to IEEE Fellow for contributions to network-on-chip architectures. 

Sriram Vangal is a Principal Engineer with Intel Labs researching AI-driven, in-situ silicon anomaly detection approaches to improve silicon reliability. 

He received a B.E. degree from Bangalore University, India, in 1993, an M.S. degree from the University of Nebraska, Lincoln, USA, in 1995, and the Ph.D. degree from Linköping University, Sweden, in 2007 – all in Electrical Engineering. He joined Intel Corporation in 1995 and has played a lead role in Multi-core CPU development and near-threshold voltage (NTV) computing research. 

Sriram has received two Intel Achievement Awards for his work, an Intel Labs Gordon Moore Award, and has published over 35 conference and journal papers, authored three book chapters, and has over 45 patents issued, with 20+ pending. 

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About the Author
Scott Bair is a Senior Technical Creative Director for Intel Labs, chartered with growing awareness for Intel’s leading-edge research activities, like AI, Neuromorphic Computing and Quantum Computing. Scott is responsible for driving marketing strategy, messaging, and asset creation for Intel Labs and its joint-research activities. In addition to his work at Intel, he has a passion for audio technology and is an active father of 5 children. Scott has over 23 years of experience in the computing industry bringing new products and technology to market. During his 15 years at Intel, he has worked in a variety of roles from R&D, architecture, strategic planning, product marketing, and technology evangelism. Scott has an undergraduate degree in Electrical and Computer Engineering and a Masters of Business Administration from Brigham Young University.
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