I have to temperature cycle the processor on a ceramic board between ideally +105 C and -55 C. I can make a case for limiting the higher temperature to 85C based on encapsulant but would like confirmation of storage temperature. I have the thermal design guide for the E3800 family but the guide deals with operating conditions. Any idea if the E3825 can survive 105C non-operating?
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The information that may help you is stated in the second point of section 8.4.3, on page 15 of https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-0... Chapter 8 of the Intel Packaging Databook.
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