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CL8066201939103- Manufacturing defect

Gopichand
Beginner
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Hi Team,

 

 This is Gopichand from Zettaone Technologies.

 Zettaone Technologies into PCB design and PCBA manufacturing. 

 One of our customer used (MPN :  CL8066201939103) Process in the design. During manufacturing we faced warpage of component after reflow. Thermal Profiling we used suggested by Intel. 

If any other inputs required from our side, please let us know.

Please suggest us incase of any special process is required or Tooling's are required to avoid this issue. 

 

Regards,

Gopichand

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DeividA_Intel
Employee
480 Views

Hello Gopichand,  

  

 

Thank you for posting on the Intel® communities.  

 

  

We would like to inform you that we have a forum for these specific issues and products (Intel® Core™ i7-6820EQ Processor), so we are moving it to the "Embedded Intel® Core™ Processors" forum so you can get better support for this matter.  

 

Also, I noticed that you mentioned the "Intel® Xeon® Processor D-1500 Product Family", to get proper support I recommend you open a thread in our server forums.

 

Regards,  

Deivid A.  

Intel Customer Support Technician  

 

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CarlosAM_INTEL
Moderator
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Hello, @Gopichand:

Thank you for contacting Intel Embedded Community.

We sent an email to the address related to this account with information that may help you.

Your post has been edited to avoid show information that must be handled under the Corporate Non-Disclosure Agreement (CNDA) terms.

Best regards,

@CarlosAM_INTEL

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