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I would like to connect the mentioned FPGA via a gappad to a cooling frame. The FPGA is so to speak "pressed" to the frame. The force is brought by many srews. Therefor the compression of the gappad need to be considered / calculated.
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Hi SUrba3,
Thank you for contacting Intel Community.
Please refer to Packaging specification and dimension page for the device package dimension.
https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_V
Regards,
Aim
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Hi Aim,
thanks for your reply and the link!
The PDF says A1 are the dimensions for the BGA itself. Are these dimensions valid after soldering?
I need to know the tolerances for A1 after soldering.
Regards,
Sven
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Hi Sven,
The dimension also valid after soldering. Hence you can refer to the same pdf link for tolerances after soldering.
Regards,
Aim
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Hi Sven,
Is there any further information needed for this case? If not, i will continue to close this case.
Thank you.
Regards,
Aim
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Hi Aim,
thanks. You can close this case. No more information is needed.
Regards,
Sven
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