I would like to connect the mentioned FPGA via a gappad to a cooling frame. The FPGA is so to speak "pressed" to the frame. The force is brought by many srews. Therefor the compression of the gappad need to be considered / calculated.
Thank you for contacting Intel Community.
Please refer to Packaging specification and dimension page for the device package dimension.
thanks for your reply and the link!
The PDF says A1 are the dimensions for the BGA itself. Are these dimensions valid after soldering?
I need to know the tolerances for A1 after soldering.