Hi Emeth,
Although the document you supplied contained some very helpful information, but it is missing what I'm looking for exactly.
I use a computational fluid dynamics software to simulate airflow and temperature. Therefore, I need to be able to model the processor in my thermal model. There are few options we can use to model the processor:
1) 2-resistor model - Junction to case and Junction to board thermal resistances - Not very accurate, but the model will be very light.
2) Delphi model - It is a multi resistance model
3) Detailed model - It is usually supplied by the vendor of the component. If a thermal detailed model is not available. It could be constructed, but a lot of information would be needed:
a- Material properties mainly the thermal conductivity of the components used in the package (Heat spreader, solder balls etc…)
b- Die size and location in the package
c- Substrate thermal conductivity in-plane, and thru layers
d- Die attach
e- Thermal interface material between Die and heat spreader
Regards,
Talal Habib.
