Proposal for Improved CPU Cooling System with Grooved Design for Liquid Metal Thermal Inter

[Yiten]

Dear Intel Team,

I hope this message finds you well. Please call me Mr. Shao, and I am an enthusiast in PC hardware design and thermal management solutions. I am writing to share an idea that I believe could significantly enhance the cooling performance of Intel processors and promote the adoption of liquid metal (liquid metal TIM) as a more efficient thermal interface material.

Proposal: A Grooved CPU and Heatsink Design

The concept involves introducing a grooved (concave) design on the CPU’s integrated heat spreader (IHS), paired with a corresponding convex surface on heatsinks or cooling solutions. This design would create a secure containment area for liquid metal, reducing the risk of leakage while maximizing contact surface area for efficient heat transfer.

Key Benefits:
1. Improved Safety: The grooved design minimizes the risk of liquid metal spilling onto the motherboard, eliminating potential electrical short-circuits.
2. Enhanced Thermal Conductivity: Liquid metal is significantly more efficient than traditional thermal pastes, and the grooved design ensures even distribution and retention of liquid metal in the thermal interface.
3. Increased Adoption: By addressing the safety and ease-of-use concerns, this design could accelerate the adoption of liquid metal cooling systems in both consumer and professional applications.
4. Backward Compatibility: The grooved design could be implemented without impacting compatibility with traditional thermal pastes, ensuring flexibility for users who prefer conventional methods.

Implementation Considerations:
• Manufacturing Adjustments: While this design introduces some additional complexity in the manufacturing process, modern CNC machining and precision engineering should make this feasible without substantial cost increases.
• Ecosystem Integration: Collaborating with cooler manufacturers to standardize the convex heatsink design would ensure a smooth transition and wide adoption.
• Target Audience: This design could initially target high-performance CPUs (e.g., K-series, HEDT platforms) where thermal management is critical.

Closing Remarks

I believe this proposal aligns with Intel’s vision of delivering cutting-edge performance and reliability. The grooved CPU cooling system could be a groundbreaking innovation, setting a new standard for thermal management in the industry. I would be happy to provide additional details or collaborate further if there is interest in exploring this concept.

Thank you for your time and consideration. I look forward to hearing your thoughts.

Best regards,
[Mr shao]<email removed>

[Mike_Intel]

Hello Yiten,

Thank you for posting in Intel community Forum.

First of all, we appreciate this suggestion. Let me also gather some details about this suggestion.

1. Just to check, what is the model of your processor?
2. What is your inspiration to come up with this idea?
3. Do you have any illustration regarding this suggestion?

If you have questions, please let us know. Thank you.

Best regards,

Michael L.

Intel Customer Support Technician

[Mike_Intel]

Hello Yiten,

I hope this message finds you well. 

Were you able to check the previous post?

Please let us know if you still need assistance.

Best regards,

Michael L.

Intel Customer Support Technician

[Mike_Intel]

Hello Yiten,

I hope you are having a good day.

I just want to update you that already forwarded your feedback to our management however we don't have any ETA on the approval process.

Since the proposal is now forwarded to our Management, I need to close this inquiry. 

If you need further assistance, please post a new question as this thread will no longer be monitored. 

Thank you and have a great day. 

Best regards,

Michael L.

Intel Customer Support Technician