Intel Foundry’s Advanced Packaging Enables Next-Gen Technologies and Capacity

By Mark Gardner, Vice President and General Manager of the Packaging and Test Business Group at Intel Foundry.

In the rapidly evolving artificial intelligence (AI) landscape, change remains the only constant. The semiconductor industry is experiencing an unprecedented shift toward disaggregated architectures, where chiplet-based designs are becoming the new standard for complex systems. Successfully integrating these diverse chiplets into cohesive system-on-chips (SoC) solutions demands not only flexible packaging technologies and breakthrough innovations but also the capacity and secure supply chain to meet this demand. Intel Foundry is at the forefront of this transformation, continuously advancing our comprehensive advanced packaging portfolio while pioneering next-generation technologies that will redefine the chiplet design landscape.

At the recent International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2025, Intel Foundry showcased the expansion of our advanced packaging portfolio, reinforcing our commitment to delivering cutting-edge solutions that meet the diverse and evolving needs of our customers today. This expanded portfolio, first introduced at our Intel Foundry Direct Connect event earlier this year, enhances our current Embedded Multi-die Interconnect Bridge (EMIB) and Foveros 2.5D solutions.

Specialized Advanced Packaging Solutions

Since its introduction in 2017, EMIB has served as a cost-effective alternative to silicon interposers, providing reliable 2.5D interconnect solutions by embedding bridges directly in the substrate to expand reticle limits. As industry demands for higher bandwidth and enhanced power delivery intensified, Intel Foundry evolved the original EMIB architecture into two specialized solutions: EMIB-M and EMIB-T.

EMIB-M builds on the foundational design by integrating metal-insulator-metal (MIM) capacitors to optimize input/output (I/O) signal integrity and power delivery performance. For applications requiring even greater bandwidth and power capabilities—such as high bandwidth memory (HBM) and UCIe products—EMIB-T adds through-silicon vias (TSVs) in addition to MIM capacitors to meet these demanding specifications.

This dual-solution approach enables customers to convert existing designs while benefiting from reduced silicon utilization, shorter production cycles, and the elimination of wafer-level assembly (WLA) steps required by traditional silicon interposer solutions. Further, EMIB packaging technologies enable ultra large form factor devices with no reticle size limitation, making it an ideal choice for emerging AI devices.

Foveros represents Intel Foundry's flagship silicon interposer solution, with multiple Intel products already in high-volume manufacturing leveraging this high-performance advanced packaging technology. As Intel Foundry expands to serve external customers, the demand for diverse chip-on-wafer solutions grows, driving the development of two complementary offerings: Foveros-B and Foveros-R.

Foveros-R delivers a cost-optimized alternative to Foveros-S (our premium silicon interposer solution) by utilizing redistribution layers (RDL) to provide scalable performance across a wide range of customer design requirements. For larger, high-performance computing (HPC) applications requiring enhanced routing density, Foveros-B integrates bridges to maximize interconnect efficiency and performance.

Together, this comprehensive three-solution portfolio—Foveros, Foveros-R, and Foveros-B—creates a complete spectrum of 2.5D chiplet stacking capabilities, enabling Intel Foundry to address the full breadth of customer performance and cost requirements across diverse market segments.

Creating the Future Through Innovation in Advanced Packaging

Beyond expanding our current advanced packaging portfolio, Intel Foundry continues to pioneer innovative research in semiconductor assembly technologies. At the IMAPS Symposium, the keynote by Intel Foundry’s Dr. Tarek Ibrahim highlighted two transformative technologies poised to reshape the future of packaging: omni-directional panel production and glass substrates.

Our exploration of omni-directional panel production represents a fundamental shift from traditional circular wafer manufacturing to rectangular panel formats. This transition can significantly increase manufacturing efficiency while enabling larger form factors that can unlock new performance possibilities for complex, multi-chiplet designs.

Simultaneously, our glass substrate research addresses critical scaling challenges in advanced packaging. Glass substrates offer the potential for finer feature scaling, larger package dimensions, and enhanced high-speed I/O performance—all while dramatically reducing the warpage issues that limit traditional organic substrate solutions. Further, glass substrates offer the ability to seamlessly integrate electrical and optical interconnects. These improvements could enable unprecedented levels of integration and performance density.

Through our dedicated R&D efforts, Intel Foundry continues to pioneer these and other technologies, driving innovations that both enhance our advanced packaging portfolio and establish new industry standards for semiconductor assembly solutions.

Intel Foundry Advanced System Assembly and Test (Intel Foundry ASAT) stands at the forefront of advanced packaging innovation, driving the industry toward next-generation semiconductor solutions. We are committed to continuously enhancing our technology portfolio to meet evolving customer requirements, investing in R&D to pioneer breakthrough packaging technologies, and delivering the trusted, reliable services that our customers depend on for their most critical applications.

As the semiconductor landscape grows increasingly complex, ASAT remains dedicated to providing comprehensive solutions and capacity that not only address today's challenges but anticipate tomorrow's opportunities, ensuring our customers maintain their competitive edge in rapidly evolving markets.

If you are interested in learning more about our advanced packaging solutions, please reach out to our sales team at foundry.contact@intel.com.