InnovateFPGA contest sponsors – Terasic, Intel, Microsoft, Analog Devices, Arrow, Digi-Key, Mouser Electronics, and Macnica – invite ecologically minded teams to enter this year’s design contest to win cash prizes, medals, and fame. Competing teams will use the Terasic DE10-Nano FPGA Cloud Connectivity Kit with Analog Devices plug-in cards and IoT cloud connections provided by Microsoft Azure Cloud Services to create design solutions that help to reduce the environmental impact and the demands that we place on the Earth’s resources. All submitted projects must be based on and make complete use of the Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit.
The Terasic DE10-Nano FPGA Cloud Connectivity Kit with an Analog Devices plug-in card and credits/limited-time access to Microsoft’s Azure Cloud Services will be provided at no cost to selected participating teams.
Contest teams will demo their designs at regional finals and at the Grand Finale, to be held in San Jose, California on June 23, 2022.
Click
here for more information and to enter the InnovateFPGA contest. Technical proposals are due by September 30, 2021.
For full contest rules, click
here.
Get details on the Terasic DE10-Nano FPGA Cloud Connectivity Kit by clicking
here.
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