Package specs/drawing

[KLiew7]

Hi,

I would like to request package specs/drawing for this PN#FH8065301487717S R3UT (Intel Atom E3845). As I want to know the component package size and ball dimension.

Could you please assist?

Thanks.

[Diego_INTEL]

Hello @KLiew7,

Thank you for contacting Intel Embedded Community.

The Bay Trail family is discontinued and no longer actively supported.

But from the document #538136 - E3800 Datasheet in section 10 we have:

"The SoC comes in a 25 mm X 27 mm Flip-Chip Ball Grid Array (FCBGA) package and consists of a silicon die mounted face down on an organic substrate populated with 1170 solder balls on the bottom side."

You may check the Bay Trail section in RDC to check what is available too.

https://www.intel.com/content/www/us/en/products/platforms/details/bay-trail/docs.html

I hope this is what you need.

Best regards,

@Diego_INTEL