Thank you for contacting the Intel Embedded Community.
In order to help you, we have contacted you via email.
Thanks in advance for your cooperation.
Thanks for your replies.
Related to reflow soldering process, please review the information stated in section 9.4, on pages from 3 to 7 of http://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-09-databook.pdf chapter 9 of the Intel Packaging Databook.
On the other hand, the stencil information and SMT recommendations that may help you are stated in section 14.9.3, on pages 23 and 24; and in section 14.9.7, on page 27 respectively of http://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-14-databook.pdf chapter 14 of the Intel Packaging Databook.
We hope that this information may help you.