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Related to reflow soldering process, please review the information stated in section 9.4, on pages from 3 to 7 of http://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-09... chapter 9 of the Intel Packaging Databook.
On the other hand, the stencil information and SMT recommendations that may help you are stated in section 14.9.3, on pages 23 and 24; and in section 14.9.7, on page 27 respectively of http://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-14... chapter 14 of the Intel Packaging Databook.
We hope that this information may help you.