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Hello,
I'm looking for the package characteristics of several Intel processors to evaluate the assembly requirements of the processors on our boards. I'm looking in particular for the ball pitch used for:
- Intel XEON D family: for the D-1500, it seems to be 0.7mm but can you confirm ?
- Also, I can't find the information for the recent devices, such as D-1700, D-1800, D-2700 and D-2800, can you help ?
- I'm looking for the same information for the Raptor Lake HRE (iCore 3, 5 & 7) family,
Thanks for your help,
Thomas
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Hello @Teepee,
Thank you for contacting Intel Embedded Community.
You can check the document #574966 - All Segments MAS Documents or the following link:
The 1500-D is Grangeville, you can check section 2.7 Microserver - Grangeville (Broadwell DE) from document #574966 or directly look for the document #544983 - Manufacturing with the Intel Microserver Platform Code Named Grangeville.
Just to confirm, you are correct, the Ball Pitch is 0.7 mm.
For the other Xeon devices I think they are Ice Lake-D, you can check document #627151 for them, includes Idaville LCC and HCC.
For Raptor Lake, you can check document #735615.
You will need a Premier account in order to get access to these documents.
I hope this may be of help.
Best regards,

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