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Request for FCBGA-1364 Detailed Footprint Dimension

lguancho
Beginner
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Hi.   I need to do BGA reballing for an Intel Embedded  Flip Chip BGA with 1364 ball.  The size of the BGA is 37.5 x 32.0 x 1.6 mm.  

The Intel Part Number is SR1W0 (Intel Core I7 Mobile I7-4702EC)

 

In order to fabricate the stainless steel reballing stencil,   I need the detailed CAD footprint for the part.  The short form 1 page mechanical drawing I can find from open source does not have much details.

 

Appreciate if Intel support group could email me the relevant details

 

Thanks

 

lguancho

 

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CarlosAM_INTEL
Moderator
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Hello, @lguancho:

 

Thank you for contacting Intel Embedded Community.

 

The Intel® Core™ i7-4702EC is a Haswell Processor that has been discontinued and is no longer supported, as is stated in the Specifications section, specifically in the Supplemental Information subsection of the following website:

https://www.intel.com/content/www/us/en/products/sku/75556/intel-core-i74702ec-processor-8m-cache-up-to-2-00-ghz/specifications.html

 

We need to clarify that the Haswell processor family has been discontinued and is no longer supported, as you may verify on the following website:


https://www.intel.com/content/www/us/en/support/articles/000022396/processors.html 

However, you may find the available documentation for the Haswell processors that may help you on the following websites:

 

https://www.intel.com/content/www/us/en/products/platforms/details/haswell-e.html

https://www.intel.com/content/www/us/en/products/platforms/details/haswell-dt-refresh.html

 

Best regards,

@CarlosAM_INTEL.

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