What we updated on the package drawing? The PCN states a POD update to reflect the current exposed pad design. I do not see any changes on the package drawing.
The change was in the three exposed metal pins underneath the package of EN6360QI/QA and EV1380QI.
that change in the package will not affect the device footprint nor package dimensions.
So no additional action required as there is no impact to the fit and function of the product and the affected pads are not electrically connected or soldered in the customer’s board assembly process.