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Hello everyone,
this is Ivy, I work for an OEM company, which specializes in PCBA manufacturing, I am writing to ask your assistance in MAX® 10 10M08 FPGA 10M08SCE144C8G - MDDS.
We applied 10M08SCE144C8G to a board used in the sensor , and all boards detected malfunction. Troubleshooting turns out soldering temperature may be the primary reason for the defective board. Thus, we would like to have your suggestion on soldering temperature.
We failed in searching hints in the data sheet, and our experience didn't work well in this production, due to we had ordered 2 to 3 batches of goods to test it, and all boards kept dead in rework testing. We would really appreciate it if you could offer us proper soldering temperature or suggestions, thank you.
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Hello,
For your information, regarding the reflow temperature, our device follows device reflow J-STD 020E or later revision.
Hope that helps and do let me know if I can assist you further.
Best regards,
Nazrul Naim
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Hello,
As we do not receive any response from you on the previous question/reply/answer that we have provided. Please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.
Best regards,
Nazrul Naim

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