BACKING

[OanaOlariu]

Hello,

We need to know if this component, EPCQ64ASI16N, can be baked (due to reason: improper packaging we need to bake the parts before to use them in production) and if it can be backed we need to receive from you the time required for backing  and the baking temperature (package dimension, would be also very helpful for us)

Kindly, awaiting for your soonest reply,

Oana

[FvM]

Hello,
you can refer to IPC/JEDEC J-STD-033D for industry standard drying conditions.

[Farabi]

Hello,

Yes, it can be baked. You can refer to : https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an353.pdf

for reflow setting.

regards,

Farabi

[NazrulNaim_Intel]

Hi,

As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

Regards,

Nazrul Naim