EP4CGX110CF23CN, which package

[Oliver_I_Sedlacek]

Is this FBGA a flip chip or wire bond as I need to know which package I will get.

The data sheet (attached) lists both.

[NazrulNaim_Intel]

Hello,

To answer your question, you will get the FBGA-484 package.

Hope that answers your question.

Best regards,

Nazrul Naim

[Oliver_I_Sedlacek]

No, that doesn't answer the questions as both options listed are FBGA-484.

[NazrulNaim_Intel · Accepted solution]

Hello,

I'm truly sorry for the delay. For your information this device is Wire Bond.

Hope that answers your question.

Best regards,

Nazrul Naim

[NazrulNaim_Intel]

Hello,

I’m glad that your question has been addressed, I now transition this thread to community support. If you have a new question, Please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

Best regards,

Nazrul Naim