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EPM570F256I5 solder ball composition

SL10
Novice
144 Views

Whether there have been any changes in the solder ball composition of the MAX II CPLD EPM570F256I5.

 

 

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1 Solution
YuanLi_S_Intel
Employee
126 Views

Hi Sir,


I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf


Thank You.


View solution in original post

2 Replies
YuanLi_S_Intel
Employee
127 Views

Hi Sir,


I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf


Thank You.


View solution in original post

SL10
Novice
122 Views

Thank you YuanLi_S_Intel for the fast response. The problem is resolved.

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