EPM570F256I5 solder ball composition

[SL10]

Whether there have been any changes in the solder ball composition of the MAX II CPLD EPM570F256I5.

[YuanLi_S_Intel · Accepted solution]

Hi Sir,

I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf

Thank You.

[SL10]

Thank you YuanLi_S_Intel for the fast response. The problem is resolved.