Reflow profile, time above liquidous temperature

[SL10]

We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was outside of the acceptable range of the solder paste  (NC676, TL=93 sec actual vs 40-80 sec acceptable). However, AN353 stated range for TL is 60-150 sec. The questions are: a) does other customer have similar experience with the solder ball crack at the ball/IC interface and b) could that be correlated to the longer time above liquidous temperature. 

[NurAiman_M_Intel]

Hi,

Thank you for contacting Intel community.

Kindly share the picture of the cracked solder ball for further advise.

Thanks.

Regards,

Aiman

[SL10]

Examples of cracked solder balls show below (BGA on TOP side):

Thanks

[NurAiman_M_Intel]

Hi,

Thank you for the images. Our Quality team shall be in touch with you for further clarification.

Regards,

Aiman

[NurAiman_M_Intel]

Hi,

If you have further questions, please email our Quality team(Sam) that has reach out to you until next week. Else, we will need to set this case close.

Thank you.

Regards,

Aiman

[BG-10649]

Hello,  

We have similar issue with soldering component 10CL055YF484I7G on an 8 layer PCB. Can you provide more information regarding the correction that you have proposed?

Best Regards,

Kiril Ivanov

kiril.ivanov@apyxmedical.com