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Reflow profile, time above liquidous temperature

SL10
Novice
185 Views
We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was outside of the acceptable range of the solder paste  (NC676, TL=93 sec actual vs 40-80 sec acceptable). However, AN353 stated range for TL is 60-150 sec. The questions are: a) does other customer have similar experience with the solder ball crack at the ball/IC interface and b) could that be correlated to the longer time above liquidous temperature. 
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4 Replies
NurAiman_M_Intel
Employee
167 Views

Hi,


Thank you for contacting Intel community.


Kindly share the picture of the cracked solder ball for further advise.


Thanks.


Regards,

Aiman


SL10
Novice
159 Views

Examples of cracked solder balls show below (BGA on TOP side):

 

SL10_0-1622731597358.jpeg

 

 

SL10_1-1622731597476.png

 

 

SL10_2-1622731597512.png

 

Thanks

NurAiman_M_Intel
Employee
138 Views

Hi,


Thank you for the images. Our Quality team shall be in touch with you for further clarification.


Regards,

Aiman


NurAiman_M_Intel
Employee
122 Views

Hi,


If you have further questions, please email our Quality team(Sam) that has reach out to you until next week. Else, we will need to set this case close.


Thank you.


Regards,

Aiman


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