This FPGA failed during our customer's (ViaSat) test process. Samples were returned to Benchmark for analysis.
Our internal FA lab performed X-ray analysis, and no issues were found with the solder joints/solder balls. This analysis was done to rule out the possibility of a solder ball/solder ball connection issue. There don’t appear to be any obvious issues with the solder joints, right now, everything is pointing to an issue with the FPGA itself.
Potential lot of parts in Question:
VIA351-4234-030
WBB573151
WPM255233
Intel
EP2S30F672I4
160pcs in package, 560pcs total received on 03-13-2019
1907 Date Code
S906AKA11 Lot Code
We have 1 part ready to return for Failure Analysis.
