Whether or not it can be cleaned after mounting the board

[t_iikubo2021]

基板実装後の清掃可否

エレックデータ株式会社と申します。そして私は飯久保です。

基板実装後の洗浄可否について、自社品数を対象に調査を行っています。

洗浄条件を整理しました。

御社の製品のカタログ等に洗浄条件を記載した資料が見当たりませんでしたが、フロー/リフローはんだ実装後の洗浄条件を明記した資料はありますか?

もしそうなら、私は資料を受け取りたいです。

洗浄条件が不可能な場合でも、それを明記した文書があると便利です。

品番

5M240ZT100C4N

5M240ZT100C5N

10CL016YF484C8G

EPCQ32ASI8N

10CL010ユウ256C6G

10CL010ユウ256C8G

10CL025ユウ256C8G

10CL040YF484C8G

10CL055YF484C8G

10M08SCE144C8G

[NazrulNaim_Intel]

Hello,

Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.

Warm Regards,

Nazrul Naim

[NazrulNaim_Intel]

Hello,

Sorry for the delay. Most of the devices/packages are either:

• Wire Bonded Plastic Packages or
• Flip Chip Packages with vents underneath the lid

Both these type of packages can be washed. However, for the flip chip, we need to temporary seal the side vents. There is a process for this in the S10 MAS.

Take note that both these types of packages can be washed after SMT onto the boards. However, the boards/components need to be bake dry (above 100C) to remove all liquids. This will prevent delamination of the board and devices.

Hope that answers your question.

Best regards,

Nazrul Naim

Best reagrds,

Nazrul Naim

[NazrulNaim_Intel]

Hi,

As we do not receive any response from you on the previous question/reply/answer that we have provided, for now I will set this case to Close-Pending. 

Regards,

Nazrul Naim