Hello Aim, I have looked at the information that you have sent. For My part , it references to have a Peak Reflow Temperature of 220C it is a 19 x 19 x 1.8 FPBGA part Number EPM2210F324I5 with a TIN LEAD finish . My question is How can you have that exact same package and have it with Pb_Free Balls and have a Peak Reflow Temp of 250C? I also see that the Note on the Bottom of the Table says that the Classification Temperature is +/- 2 C, would that mean that the Peak reflow Temp could be as high as 222 and as low as 218? Also , is that Peak Reflow Temp a recommended , I have to run this PART a bit higher due to a SAC045 BGA, I need to be at least 221, for this part, will that be OK?
This Device from Intel has Tin Lead Plating. we also have other parts on the Board that are Pb free , It may not be recommended but this is what we have and we need to developed a Reflow Profile that will be ale to satisfy these conditions of having a PB Free parts and having Tin Pb parts. The issue is this INTEL part that I am asking about , your material says Peak Reflow of 220 C, this creates an issue since the Profile that we need has to be at least 219 C to accommodate the PB free part. What I am asking is if the 220 C is a recommended Peak reflow or can you be slightly over , possibly 1 or 2 degrees over.