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Hello
We are using max 10 FPGA (10M16SCU169I7G) industrial grade- working temperature ranges from -40°C to 100°C
When the board is powered UP, FPGA temperature reaches to 40 °C without programming.
And after Programming temperature reaches to 42°C (sometimes 43°C to 50 °C).
It means temperature is almost 16 °C to 17 °C higher than ambient temperature.
Our project needs to test at 85°C and at that time FPGA temperature goes above 100 °C.
Which is not supposed to good for FPGA working.
So Is there any setting or IP related any settings in quartus prime to reduce FPGA temperature.
Regards,
Gouri
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device power dissipation is caused by static losses + switching activity, Early-Power-Estimator tool and Quartus Power Analyzer can give you some insights.
There are few options to reduce power consumption of an existing design, e.g. reduce clock frequency of parts with biggest logic utilization.
You can also consider to improve heat dissipation through ground balls by providing VIPPO pads and continuous ground planes if not already present.
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Hi,
according to report, it's mostly static core power dissipation causing the heating. I'm a bit surprized about large static power dissipation reported by power analyzer.
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Hi,
Along with recommendations from community member FvM, I would encourage you to go through following links:
https://www.intel.com/content/www/us/en/docs/programmable/683400/18-0/power-management-overview.html, especially section 2.3.
Intel® MAX® 10 FPGA Early Power Estimator (EPE) Design Tool
You should also think of have a proper cooling solution for the device. The EPE can help you with some recommendations for that.
Hope this helps.
Regards

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