Need PCB land pattern for part EP4CE6F17C8N

[SLB-Aman_Arab]

Hello Team,

Please share the recommended land pattern for part EP4CE6F17C8N.

Thanks,

Aman Arab

[Farabi]

Hi Aman, 

Please refer to attached package drawing for land pattern recommendation. link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00230-03.pdf

FBGA-256 Ball Grid Array- 0.8mm pitch

Ball pitch = 0.8mm

Pad(Land) Diameter = 0.3mm to 0.35mm

Solder Mask Opening = 0.4mm

Pad Type = NSMD (Non-Solder Mask Defined) recommended

NSMD Pad size = 0.30mm to 0.33mm diameter

Solder Mask Clearance = +0.05mm all around pad

Package size = 17mm x 17mm

regards,
Farabi

[SLB-Aman_Arab]

Hello Farabi,

Thank you for your response. We kindly request the pin numbering details from pin 1 to pin 256, along with the corresponding pin functions/significance for each. This information is essential for our analysis and proper integration. The details you shared are helpful in understanding the footprint only.

Thanks,

Aman Arab

[SLB-Aman_Arab]

Hello Team,

Any updates on the requested PINs details?

Thanks,

Aman Arab

[FvM · Accepted solution]

BGA pin numbering is alphanumerical (A1..A16, B1..) etc., it's specified in above linked package drawing, please review.
Pinout is described in separate documents, browse https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/lit-dp.html