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Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
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10M16DCU324I7G package

XQSHEN
Novice
1,358 Views

Hello,

How can I know if 10M16DCU324I7G package belongs to which one in below table?

 

XShen1_0-1628991102061.png

 

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AminT_Intel
Employee
1,339 Views

Hello,

 

OPN: 10M16DCU324I7G 

Package Type: U

Package Code: 324

 

From Altera Device Package Information they are 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond. Thus, they are 0.70mm UBGA (wirebond) from Table 3.

 

AminT_Intel_0-1629178778964.png

 

Thanks

 

 

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AminT_Intel
Employee
1,336 Views

Hello,

 

Sorry there was a typo. It was 0.80 mm not 0.70 mm

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XQSHEN
Novice
1,317 Views

Thanks, so I should set PCB solder pad size = 0.34, solder mask = 0.4, right?

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AminT_Intel
Employee
1,304 Views

Hello,

 

Please follow the recommended pad size on of your device from the table.

 

Thanks

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XQSHEN
Novice
1,286 Views

Is my understanding of the table correct?

 

set PCB solder pad size = 0.34, solder mask = 0.4

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AminT_Intel
Employee
1,270 Views
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AminT_Intel
Employee
1,254 Views

We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.

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