Package Type: U
Package Code: 324
From Altera Device Package Information they are 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond. Thus, they are 0.70mm UBGA (wirebond) from Table 3.
Yes. Please refer to page 6 of this document: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an114.pdf
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