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10M16DCU324I7G package

XQSHEN
Novice
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Hello,

How can I know if 10M16DCU324I7G package belongs to which one in below table?

 

XShen1_0-1628991102061.png

 

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AminT_Intel
Employee
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Hello,

 

OPN: 10M16DCU324I7G 

Package Type: U

Package Code: 324

 

From Altera Device Package Information they are 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond. Thus, they are 0.70mm UBGA (wirebond) from Table 3.

 

AminT_Intel_0-1629178778964.png

 

Thanks

 

 

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AminT_Intel
Employee
521 Views

Hello,

 

Sorry there was a typo. It was 0.80 mm not 0.70 mm

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XQSHEN
Novice
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Thanks, so I should set PCB solder pad size = 0.34, solder mask = 0.4, right?

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AminT_Intel
Employee
489 Views

Hello,

 

Please follow the recommended pad size on of your device from the table.

 

Thanks

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XQSHEN
Novice
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Is my understanding of the table correct?

 

set PCB solder pad size = 0.34, solder mask = 0.4

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AminT_Intel
Employee
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AminT_Intel
Employee
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