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Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
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BGA Material for the 5CEFA5U19I7N FPGA

DAW290
Beginner
1,042 Views

There is a three page document "Altera Device Package Information" (copy att.) that shows two options for solder ball composition for the 5CEFA5U19I7N part: "Regular" is 63% Sn/37% Pb and "Pb-free" is 3% Sn.

 

How does one specify the solder ball option when ordering this part? Thanks!

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NazrulNaim_Intel
Employee
988 Views

Hello,

 

Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.

 

Warm Regards,

Nazrul Naim


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NazrulNaim_Intel
Employee
923 Views

Hello,

Sorry for the dela, for your information, the one that specify the solder ball option when ordering is the suffix. For an example 5CEFA5U19I7N. The N suffix is PB-Free packaging.

 

Hope that answers your question.

 

Best regards,

Nazrul Naim

NazrulNaim_Intel_0-1701742593801.png

 

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NazrulNaim_Intel
Employee
895 Views

Hello,

 

It has been a while since you posted on this case. Do you have any more questions regarding this case. If no, I will later then set this case to Close-Pending.

 

Best regards,

Nazrul Naim


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DAW290
Beginner
787 Views

Thank you for the help with my case. I understand from your reply that the "N" suffix specifies Pb-free packaging. Would ordering the part without the "N" suffix - that is, ordering the part number 5CEFA5U19I7 - result in parts packaged with the 63Sn:37Pb solder ball composition? This was an option highlighted in a package information document (copy att.).

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