BGA Material for the 5CEFA5U19I7N FPGA

[DAW290]

There is a three page document "Altera Device Package Information" (copy att.) that shows two options for solder ball composition for the 5CEFA5U19I7N part: "Regular" is 63% Sn/37% Pb and "Pb-free" is 3% Sn.

How does one specify the solder ball option when ordering this part? Thanks!

[NazrulNaim_Intel]

Hello,

Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.

Warm Regards,

Nazrul Naim

[NazrulNaim_Intel]

Hello,

Sorry for the dela, for your information, the one that specify the solder ball option when ordering is the suffix. For an example 5CEFA5U19I7N. The N suffix is PB-Free packaging.

Hope that answers your question.

Best regards,

Nazrul Naim

[NazrulNaim_Intel]

Hello,

It has been a while since you posted on this case. Do you have any more questions regarding this case. If no, I will later then set this case to Close-Pending.

Best regards,

Nazrul Naim

[DAW290]

Thank you for the help with my case. I understand from your reply that the "N" suffix specifies Pb-free packaging. Would ordering the part without the "N" suffix - that is, ordering the part number 5CEFA5U19I7 - result in parts packaged with the 63Sn:37Pb solder ball composition? This was an option highlighted in a package information document (copy att.).