Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
Announcements
FPGA community forums and blogs on community.intel.com are migrating to the new Altera Community and are read-only. For urgent support needs during this transition, please visit the FPGA Design Resources page or contact an Altera Authorized Distributor.
21615 Discussions

Commercial Device Die Bonding

Altera_Forum
Honored Contributor II
‎07-29-2010 04:57 PM
1,068 Views

Are commercial devices eutectically bonded?

0 Kudos

Link Copied

1 Reply
Altera_Forum
Honored Contributor II
‎07-29-2010 06:48 PM
370 Views

I don't know if anyone here can answer this for you, unless we have a packaging specialist in the forum, but from what I know, the bonding is the same regardless of commercial, industrial, or military applications.  

 

Usually it's the same die, same bond wires. Just different specs, and with military, usually a ceramic package for heat dissipation.
0 Kudos
Copy link
Reply

Community support is provided Monday to Friday. Other contact methods are available here.

Intel does not verify all solutions, including but not limited to any file transfers that may appear in this community. Accordingly, Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.

For more complete information about compiler optimizations, see our Optimization Notice.