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Hello,
I'm Ionela Hagighiol ,SQE from Flex, Romania and we have the below issue with this part manufactured by you.
Please advise how to proceed further.
Component details:
Material PN |
ALC3-1AB310260004_REP |
Material Description |
ICFPGA5SGXMA7N2F45I3NStratix5B |
Material SN or Lot Nr |
N/A |
Date Code or Part Mark |
1607 |
Supplier Name |
ARROW ASIA DISTRIBUTION GBR |
Supplier PN/MPN |
5SGXMA7N2F45I3N |
- Problem description: Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C
- Detected by: Customer field failure, failure confirmed by factory tests
- Quantity Affected: 1 PCS
- Failure Message: SM BIP8 Error Count on L1CH2 on PM
- Flex or Nokia analysis:
This unit failed in field at customer. At Flex factory tests it failed with Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C. The suspected component for the issue was Obelix component (ALC3-1AB310260004_REP) and was sent to be replaced. With the new component the unit passed tests. Obelix component to be sent to supplier to re-run tests and find root cause of failure.
Replacing the component solved the problem and card passed factory tests.
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Hi Ionela,
Thank you for using Intel Community Forum.
The case will be continued support through email as confidential info is required.
Thanks!
Wani
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Hi Ionela,
Thank you for using Intel Community Forum.
The case will be continued support through email as confidential info is required.
Thanks!
Wani

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