Event no 119751

[Ionela]

Hello,

I'm Ionela Hagighiol ,SQE from Flex, Romania and we have the below issue with this part manufactured by you.

Please advise how to proceed further.

Component details:

Material PN	ALC3-1AB310260004_REP
Material Description	ICFPGA5SGXMA7N2F45I3NStratix5B
Material SN or Lot Nr	N/A
Date Code or Part Mark	1607
Supplier Name	ARROW ASIA DISTRIBUTION GBR
Supplier PN/MPN	5SGXMA7N2F45I3N

1. Problem description: Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C

2. Detected by: Customer field failure, failure confirmed by factory tests

3. Quantity Affected: 1 PCS

4. Failure Message: SM BIP8 Error Count on L1CH2 on PM

5. Flex or Nokia analysis:

This unit failed in field at customer. At Flex factory tests it failed with Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C. The suspected component for the issue was Obelix component (ALC3-1AB310260004_REP) and was sent to be replaced. With the new component the unit passed tests. Obelix component to be sent to supplier to re-run tests and find root cause of failure.

              Replacing the component solved the problem and card passed factory tests.

[Zawani_M_Intel · Accepted solution]

Hi Ionela,

Thank you for using Intel Community Forum.

The case will be continued support through email as confidential info is required.

Thanks!

Wani