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Some of our machines with a Cyclone 4 inside are sometimes running at higher temperatures. This means that the temperature of the FPGA may sometimes be higher than specified for the standard version of the FPGA.
We would like to estimate the reliability (MTBF, failure rate) of an FPGA operated at slightly higher temperatures. I found formulas to do that here: Reliability Report 52 Q3 2011 Up until what junction temperatures are these formulas useable? where the same measurements performed for automative/ industrial/ military quality as for the standard parts? thanks for any help!Link Copied
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Temperature may increase timing specifications and maximal current.
I have an other question : What may differ between Commercial and Industrial FPGA except temperature ? Does this setting (in Device Assignment) on Quartus affect the synthesis (use different models) ?
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