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How do I enter a return request for an FPGA 5SGXMA5N3F40C4N?


5SGXMA5N3F40C4N received at SMT in waffle pack missing solder ball on BGA.

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Thank you for contacting Intel community.


For your information, Intel PSG perform 100% Ball Scan prior to shipment, so it's unlikely that the device will have been shipped with a missing ball. There is a high possibility that it was damaged in transit or shipping or improper storage. We have ball scan and visual test. Plus, we have drop test proved packing. The purpose of production testing during manufacturing is to screen out bad units and in the case of this IPS, the missing solder ball would not pass the open/short test. Intel PSG Reliability Report had stated clearly that Intel PSG performs comprehensive testing and manufacturing controls on all its products. 

We could guarantee devices leave factory door in good condition. Once shipment leaves factory, we are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no ERMA/RMA will be proceeded due to the missing ball issue reported.

Customer could investigate this to come out some corrective action. Meanwhile, you may refer to the solution below on the maximum downward pressure that can be applied to the top of BGA


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