Intel Stratix10 Thermal Modelling using CTM

Benedict_Goh · ‎08-29-2022

Hi, I have previously gotten the stratix10 CTM for solidworks from Intel. However, I am having some difficulties with the thermal modelling using the CTM.

Questions as follow:

For the Compact Thermal Model (CTM), I noticed that there is a gap between the substrate and sealant layers. Is this correct? (not sure if it is alright for me to share a screenshot of the CTM here showing this gap)

To conduct a thermal analysis using the CTM, do I only input the thermal conductivity for the various items and their respective heat loads extracted from the EPE?

Is this understanding correct?
- To evaluate the junction temperatures of the dies, we first evaluate the case temperature of the IHS from thermal simulation. Then, we use this formula T_J = T_CASE + TTDP * PSI_JC (where TTDP and ψ_JC values can be extracted from the EPE) to determine its junction temperature

Do I need to input the ψ_JC values extracted from the EPE for the respective dies in the thermal simulation?

Which part of the die should the respective heat loads be applied?

I am getting a negative ψ_JC value from the EPE (HSSI_2_1). I would like to check what inputs may result in this?

I am having some difficulties in identifying the thermal conductivities for the various parts in the CTM. The list provided in the PDF documents does not seem to tally with the file names in the CTM. Are you able to provide me with some clarity?
(also not sure if I am able to attach a screenshot showing the names from the material list in the PDF and the file names of the various parts in the CTM)

Thank you!

Fakhrul · ‎08-29-2022

Hi Benedict_Goh,

Thank you for reaching out.

Just to let you know that we have received your support request and I will be working with you on this.

Allow me some time to look into your issue.

I shall come back to you with the findings.

Thank you for your patience.

Best regards,

Fakhrul

Safavi · ‎08-31-2022

Hi Benedict

This is Majid Safavi, I am the Thermal design FAE for Intel FPGA products. Below are my answers to your questions in order.

There should not be gap, there may have been some issues with the import, However it should not impact the results since there is almost no heat transferred from the bottom
Yes , add the thermal properties to all different materials in the model and add the power of each die from the EPE or PTC calculator. A file with all the thermal properties should have been sent to you.
That is correct.
That is correct and the numbers only apply to the design in hand, any changes in design can cause the TTDP or ψ_JC values to. So each design has its own unique values
just apply the power calculated for a given die to that die evenly. It looks like your device has 5 dies, Core fabric and and 4 transceivers, each gets its own power
That indicates that heat from the other dies are flowing into that die, it is perfectly normal to see that.
What is the part number and can you also email me the CTM and the material property sheet that you have, My email address is majid.safavi@intel,com

Please also send me the part number that you are using.

BR,

Majid Safavi

Benedict_Goh · ‎09-01-2022

Hi Majid, thanks for your prompt response. I have reached out to you via email.

Fakhrul · ‎09-04-2022

Hi Benedict_Goh,

I believe you have been communicating with our internal expert.

Hence, this thread will be transitioned to community support.

If you have a new question, feel free to open a new thread to get support from Intel experts.

Otherwise, the community users will continue to help you on this thread. Thank you

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Regards,

Fakhrul

Fakhrul · ‎09-06-2022

Hi Benedict_Goh,

This thread has been marked as inactive and will be transitioned to community support because there is no update received from you in a while.

If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread. If you feel your support experience was less than a 9 or 10, please allow me to correct it before closing or please let me know the cause so that I may improve your future support experience.

Thank You.

Regards,

Fakhrul