Thermal properties change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G.

[DBohr1]

We are evaluating the change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G. 

The spec for EP2AGX45DF25I3N is lidless, and EP2AGX45DF25I3G is molded thermal composite. The data from the website only shows a single set of numbers for the part family. Can you confirm that there is no difference in thermal properties for the two devices?

[JonWay_C_Intel]

Hi DBohr1

The only difference is the suffix "G".

And the reason for changing N to G is due to RoHS (fully lead free).

https://www.intel.la/content/dam/www/programmable/us/en/pdfs/literature/pcn/pdn1926.pdf

Everything else is the same.

[JonWay_C_Intel]

Correction to previous:

The molded has slightly a bigger surface area. Logically, thermally should not affect much. For dimension details you can refer to:

https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_II