We are evaluating the change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G.
The spec for EP2AGX45DF25I3N is lidless, and EP2AGX45DF25I3G is molded thermal composite. The data from the website only shows a single set of numbers for the part family. Can you confirm that there is no difference in thermal properties for the two devices?
The only difference is the suffix "G".
And the reason for changing N to G is due to RoHS (fully lead free).
Everything else is the same.
Correction to previous:
The molded has slightly a bigger surface area. Logically, thermally should not affect much. For dimension details you can refer to: