maximum force that can be apply to a F256 BGA chip

[SL10]

Does Intel have limits on how much localized force (say, a thumb press the center of IC soldered on PCB) that can be applied to a F256 BGA chip ( EPM570F256I5) without damaging it.

[NurAiman_M_Intel · Accepted solution]

Hi,

For maximum downward pressure, kindly refer to below KDB:

https://www.intel.com/content/www/us/en/programmable/support/support-resources/knowledge-base/solutions/rd04172001_4367.html

Regards,

Aiman