BGA ball composition and melting point for MPN: 5M160ZM100C5N

[spong1303]

As below information is unable found in the datasheet, pls help to check & provide BGA ball composition and melting point for MPN: 5M160ZM100C5N.

[AqidAyman_Intel · Accepted solution]

Hi Supeng,

Thank you for reaching out to Intel FPGA Community.

For your request, I need to check with the respective team. I will provide the information once I received it as soon as possible.

Regards,

Aqid Ayman

[AqidAyman_Intel]

Hi Supeng,

The BGA ball composition for MAX V CPLD is Sn:Ag:Cu = 96.5:3.0:0.5.

The melting point of SAC305 solder ball is 217'C.

Regards,

Aqid Ayman

[AqidAyman_Intel]

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