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Why do EP4CE55f23I7N chips made in Korea come in different packages? What is the difference between 484-FBGA-wire bond-a:2.40 and 484-FBGA,Options 3-wire bond?
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Hi,
Thank you for reaching out. Allow me some time to look into your issue. I shall come back to you with findings.
Thank you for your patience.
Best Regards,
Nazrul Naim
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Hello,
Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.
Warm Regards,
Nazrul Naim
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Hello,
Sorry for the delay. Which POD document were you referring to? The POD is in the link below. There is no Option-3.
The difference between Option-1 and Option-2 is the dimples created by mold ejector pins on Option-2.
Link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00416-03.pdf
Best regards,
Nazrul Naim
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The photo shows a microcircuit in a 484-FBGA package, 3-wire connection options. Either this is a fake, or there is such a case, can you answer this question for me?
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Hello,
Based on the information from our internal teams and also according to the official documentation which have been provided in the previous comment. There are only 2 options. There is no Option-3 mentioned in the official documentation for this device.
I'm truly sorry for the inconvenience and please let me know if I can be of any further assistance.
Below I will also attach the link for the official website for this device documentation.
Link : Packaging (intel.com)
Best regards,
Nazrul Naim
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Hi,
As we do not receive any response from you on the previous question/reply/answer that we have provided, for now I will set this case to Close-Pending.
Regards,
Nazrul Naim
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