Heatsink requirement

[VenuBusani]

Hello team,

In our design we are using the altera/intel part EP1K50FI256-2. Since this is BGA package and assemble in closed module can you please suggest the recommended heatsink for this part

[ak6dn]

That is not something someone else can tell you easily.

You understand (I hope) the environmental thermal characteristics you are targeting for operation, the design of your enclosure, and the estimated power dissipation of your device(s). Then your thermal engineer (you do have a thermal engineer on the project, correct?) can run all the numbers and provide recommended solutions to keep your device within operational limits.

If you truly have a closed box (ie, no external air convection) you have a an interesting/difficult problem on your hands.

[Farabi]

Hello,

Pls refer to document : https://docs.rs-online.com/b319/0900766b809b8276.pdf

and go to page 121 to get package dimension.

the dimension is 27 x 27 (mm) and you may want to search for heatsink same as this dimension so it can fit.

You can use the fin type heatsink if your application is running at higher speed.

regards,

Farabi

[NazrulNaim_Intel]

Hi,

As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

Regards,

Nazrul Naim