In our design we are using the altera/intel part EP1K50FI256-2. Since this is BGA package and assemble in closed module can you please suggest the recommended heatsink for this part
That is not something someone else can tell you easily.
You understand (I hope) the environmental thermal characteristics you are targeting for operation, the design of your enclosure, and the estimated power dissipation of your device(s). Then your thermal engineer (you do have a thermal engineer on the project, correct?) can run all the numbers and provide recommended solutions to keep your device within operational limits.
If you truly have a closed box (ie, no external air convection) you have a an interesting/difficult problem on your hands.
Pls refer to document : https://docs.rs-online.com/b319/0900766b809b8276.pdf
and go to page 121 to get package dimension.
the dimension is 27 x 27 (mm) and you may want to search for heatsink same as this dimension so it can fit.
You can use the fin type heatsink if your application is running at higher speed.
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