Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers

BGA Ball Missing

User1584607963412451
2,284 Views

Hi Team

We noticed that below mentioned part found BGA Ball Missing. Kindly refer attached physical photo for your checking. Part currently unable to use. Please advise reason.

Part # :  A1822-5764

MPN: 5AGZME7H2F35C3N

Affected GRN : # 1081229813

Affected PO#3012065744

Affected qty# :  2pcs

Reason# :  BGA Ball Missing

User1584607963412451_0-1598945321437.png

 

Thank you & Regards

CheeHeng Ng

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12 Replies
User1584607963412451
2,272 Views

Hi Team

Due to urgency, seeking for your kind assistance to revert to us at soonest possible.

Regards

CHeeHeng Ng

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User1584607963412451
2,268 Views

Hi Team

We are still awaiting your reply. Seeking for your prompt attention and please revert at soonest possible.

Thank you & Regards

CheeHeng Ng

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NurAiman_M_Intel
Employee
2,235 Views

Hi,


Apologize for the delay in response as i did not received any notification when this case was routed to me. Kindly see below response for BGA ball missing:


For your information, Intel PSG perform 100% Ball Scan prior to shipment, so it's unlikely that the device will have been shipped with a missing ball. There is a high possibility that it was damaged in transit or shipping or improper storage. We have ball scan and visual test. Plus, we have drop test proved packing. The purpose of production testing during manufacturing is to screen out bad units and in the case of this forum, the missing solder ball would not pass the open/short test. Intel PSG Reliability Report had stated clearly that Intel PSG performs comprehensive testing and manufacturing controls on all its products. 

We could guarantee devices leave factory door in good condition. Once shipment leaves factory, we are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no ERMA/RMA will be proceeded due to the missing ball issue reported.

Customer could investigate this to come out some corrective action. Meanwhile, you may refer to the solution below on the maximum downward pressure that can be applied to the top of BGA

https://www.intel.com/content/www/us/en/programmable/support/support-resources/knowledge-base/solutions/rd04172001_4367.html

 

Thanks.


Regards,

Aiman


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User1584607963412451
2,228 Views

Hi Aiman

Thanks for your reply.

In this case, appreciate if you could share the test log for this shipment for our reference. Please note our PO#3012065744, Lot code: S914AF8V0, MPN: 5AGZME7H2F35C3N

Regards

CheeHeng Ng

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NurAiman_M_Intel
Employee
2,213 Views

Hi,


I will be checking this will our internal team and will let you know once i got the findings.


Thanks.


Regards,

Aiman


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User1584607963412451
2,208 Views

Hi Aiman

Appreciate if you could expedite to provide the required test log due to urgency. We need to close this issue by this week. Hope you can assist.

Thank you & Regards

CheeHeng Ng

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NurAiman_M_Intel
Employee
2,203 Views

Hi CheeHeng,


I have share the test log through forum email for your references. Let me know if you have not received the email.


Regards,

Aiman


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NurAiman_M_Intel
Employee
2,202 Views

Hi,


Also i need to reconfirm, , I could not find the PO# based on the lot code shared below. Can you please reconfirm as we need to check in our system. On top of that, kindly check if you observed any damage on outer, inner, MBB and tray from your shipment. We need to collect information if this is mishandling from distributor.


Thanks.


Regards,

Aiman


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User1584607963412451
2,198 Views

Hi Aiman

We have received your mail on test log however the image sent cannot be viewed. Please advise if you can send in other format. 

PO was placed through Arrow Asia. You may refer to the lot code: S914AF8V0 with DC 1919 for your checking.

Regards

CheeHeng Ng

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NurAiman_M_Intel
Employee
2,193 Views

Hi CheeHeng,


I have resend new image for your references through email.

Can you help to check if you observed any damage on outer, inner, MBB and tray from your shipment. We need to collect information if this is mishandling from distributor.


Thanks.


Regards,

Aiman


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User1584607963412451
2,130 Views

Hi Aiman

Thanks for the test log.

Can you also help to get some details on how your team test the part?

1)      Type of equipment? Please share the image.

2)      Any example of test log fail for missing ball.

This data will help us to come out with disposition. Thank you.

 

Regards

CheeHeng Ng

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User1584607963412451
2,123 Views

Hi Aiman

Sorry for rushing, do you have any update on this?

Can you also help to get some details on how your team test the part?

1)      Type of equipment? Please share the image.

2)      Any example of test log fail for missing ball.

 

Thank you & Regards

CheeHeng Ng

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