I have two questions regarding FPGA cyclone 10 part 10CL016YU256I8G
1. If FPGA cyclone 10 part has undergo Reflow process twice what will be the impact for the IC and is there any solution for the same
2. If no source code is available for the obsolete part of cyclone I is there any suggestion to use cyclone 10 alternate part
Thanks and Regards
Thank you for contacting Intel community.
- The Cyclone 10 LP can undergo reflow twice. SMT engineer must make sure that on the 2nd reflow, the solder joints of the Cyclone 10 device are protected. SMT reflow peak temp is assumed to be around 240C +-5C.
2.What source code are you looking for? Kindly explain further.