Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
Announcements
Need Forum Guidance? Click here

Search our FPGA Knowledge Articles here.
19193 Discussions

How thick is the layer of gold on the leads of Intel Enpirion Power Solutions product number EM2140P01QI

MJoss2
Beginner
336 Views

I have a question regarding the Intel Enpirion Power Solutions product number EM2140P01QI

 

According to silicon expert, this part's leads have a gold finish, however I see no reference to the leads' finish in the datasheet. In order for Raytheon to assess this part's risk for gold embrittlement, we need to know the thickness of the gold finish on the leads. Could anyone please help me find out what the thickness of the gold is on this part? Any information that you or other groups might have would be greatly appreciated.

Thank you,​ Matt Joss

0 Kudos
1 Reply
Mostafa_Intel_AE
Employee
222 Views

Hello Matthew,

 

Below is the summary of the substrate pad finish of EM21XX built by different suppliers:

The Au plating thickness on the substrate pad is: Au 0.05-0.1um or Au 0.1um (min.)  depending on assembly suppliers.

 

  • EM2120H01QI / EM2120L01QI / EM2130H01QI / EM2140P01QI :
    • Hana assembly - Ni: 5um (min) / Au: 0.05 - 0.1um 
    • Unisem assembly - Ni: 2-5um /Pd: 0.1-0.2um/Au: 0.1um (min)
    • ASEKH assembly - Ni: 5um (min) / Au: 0.05 - 0.1um  

 

I hope this solve your question.

 

Thanks,

Mostafa

Reply