How to Solder a BGA Chip

[Altera_Forum]

Here I share the process of BGA for your reference. 

 1 you must buy some BGA tools and mareials: Preform,Fixture,Flux,DI water,Cleaning tray,Cleaning brush,Tweezers, blunt 6”,Acid brush ,Reflow oven or hot air system and other tools. Here is one shop to sell these things.   2. insert preform   3. Use the paste flux syringe to apply a small amount of flux to the package.   4. Use the acid brush from the kit to spread the paste evenly over the entire pad side of the package. Cover each pad with a thin layer of flux.   5. Place the package into the fixture with the fluxed side of the package against the preform.   6. Seat the preform and the package into the fixture by gently pressing down on the package. Make sure that the package sits flat against the preform.   7. Place the fixture into the hot air convection oven or hot air reballing station and start the reflow heat cycle.   8. Using tweezers, remove the fixture from the oven or reballing station and place it on the conductive tray. Allow the package to cool for about 2 minutes before removing it from the fixture.   9. When the package has cooled, remove the package from the fixture and place it solder ball side up in the cleaning tray.   10. Apply the de-ionized water to the BGA preform and wait about 30 seconds for the carrier to soak before continuing.   11. Use the pointed tweezers from the kit to remove the carrier from the package. The best method for removing the carrier is to start in one corner and peel the paper away from the package.   12. Occasionally a small amount of paper remains after the preform removal. Remove the paper fragment with the tweezers. Softly run the tweezer points between the balls while lifting the paper away from the package.   13. Immediately clean the package with DI water after removing the paper preform. Apply a generous amount of DI water and scrub the package with the brush.   14. Rinse the package with DI water. This will remove small bits of flux and paper broken loose during the previous cleaning steps. Allow package to air dry. Do not wipe package dry with dry paper towel.   15. Use a microscope to inspect the package for contamination, missing balls, and flux residue. Repeat Steps 11 through 13 if the package needs additional cleaning.

[Altera_Forum]

Let’s say, you can’t or don’t want to afford a reflow oven, and you are doing things on low budget [and you know to read or translate a little German]. Then you might be interested in this page (http://www.heise.de/hardware-hacks/artikel/smd-loeten-in-der-pizzapfanne-1276166.html). They are approaching SMD (un)soldering in a home-made fashion. In an update to their first post (http://www.heise.de/hardware-hacks/artikel/loeten-in-der-pizzapfanne-kleiner-nachschlag-1406642.html), they expand their approach to soldering BGA devices. Cool idea! 

 – Matthias

[Altera_Forum]

BGA soldering in a prototype scale with some kind of reflow oven or hot plate is in fact rather easy. 

 In contrast to the misleading title, the lengthy above post is referring to bga reballing, needed to re-use disassembled BGA devices, which is not so easy.

[Altera_Forum]

We have tried the toaster oven method and soldered a few CSG225 packages successfully. So far it works. Some images are here at numato.com/kicad-more-complex-boards-our-experiment-with-spartan6-csg225

[ORobe2]

Hello guys,

regarding this issue there is a very intresting video in the youtube named ''CS-FLUX application instructions for GPU removal or reflow''.In this video you can see all the process of soldering a bga chip using a flux (the CS-FLUX)