Reflow Process recommendations of FPGA Agilex (AGFB012R24B2I3E)

[khagesh1010]

Dear Intel team,

We would like to know technical info of FPGA Agilex (AGFB012R24B2I3E)

- Solder paste opening recommendation
- Reflow profile
- Life cycle time like how many time reflow and reheat and reballing can be done.

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Khagesh

[NazrulNaim_Intel]

Hello,

Sorry for the delay. To answer your request. For reflow profile, we follow the Industrial Standard – IPC/JEDEC: J-STD 020E or newer.

Regards,

Nazrul Naim

[NazrulNaim_Intel]

Hi,

As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

Regards,

Nazrul Naim